CA2201700A1 - Blocking system for holding multilayer printed circuit boards in place during polymerisation of the intermediate insulating sheets - Google Patents

Blocking system for holding multilayer printed circuit boards in place during polymerisation of the intermediate insulating sheets

Info

Publication number
CA2201700A1
CA2201700A1 CA002201700A CA2201700A CA2201700A1 CA 2201700 A1 CA2201700 A1 CA 2201700A1 CA 002201700 A CA002201700 A CA 002201700A CA 2201700 A CA2201700 A CA 2201700A CA 2201700 A1 CA2201700 A1 CA 2201700A1
Authority
CA
Canada
Prior art keywords
printed circuit
insulating sheets
boards
multilayer printed
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002201700A
Other languages
English (en)
French (fr)
Inventor
Pierluigi Volpi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somacis-Spa
Original Assignee
SO.MA.CI.S.-S.P.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SO.MA.CI.S.-S.P.A. filed Critical SO.MA.CI.S.-S.P.A.
Publication of CA2201700A1 publication Critical patent/CA2201700A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA002201700A 1996-04-05 1997-04-03 Blocking system for holding multilayer printed circuit boards in place during polymerisation of the intermediate insulating sheets Abandoned CA2201700A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT96MC000043A ITMC960043A1 (it) 1996-04-05 1996-04-05 Sistema per mantenere bloccati i pannelli dei circuiti stampati multistrato durante la polimerizzazione dei fogli isolanti intermedi
ITMC96A000043 1996-04-05

Publications (1)

Publication Number Publication Date
CA2201700A1 true CA2201700A1 (en) 1997-10-05

Family

ID=11357197

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002201700A Abandoned CA2201700A1 (en) 1996-04-05 1997-04-03 Blocking system for holding multilayer printed circuit boards in place during polymerisation of the intermediate insulating sheets

Country Status (5)

Country Link
EP (1) EP0800337A1 (en])
JP (1) JPH1032387A (en])
KR (1) KR970073270A (en])
CA (1) CA2201700A1 (en])
IT (1) ITMC960043A1 (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19830628C1 (de) * 1998-07-09 2000-04-20 Lauffer Maschf Verfahren zum Verpressen von Mehrlagenleiterplatten (Multilayer)
US6162314A (en) * 1998-09-29 2000-12-19 Alliant Techsystems Inc. Thermal welding of fiber reinforced thermoplastic prepreg
IT1317799B1 (it) * 2000-06-02 2003-07-15 Cedal Srl Sistema per la saldatura del pacco di layers e di fogli di pre-pregdestinato alla formazione in presse a caldo di un circuito

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE465399B (sv) * 1990-05-16 1991-09-02 Perstorp Ab Saett vid tillverkning av flerlagermoensterkort
DE4029970A1 (de) * 1990-09-21 1992-04-02 Siemens Nixdorf Inf Syst Verfahren zum verpressen von mehrlagenleiterplatten

Also Published As

Publication number Publication date
KR970073270A (ko) 1997-11-07
ITMC960043A1 (it) 1997-10-05
JPH1032387A (ja) 1998-02-03
ITMC960043A0 (en]) 1996-04-05
EP0800337A1 (en) 1997-10-08

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Legal Events

Date Code Title Description
FZDE Discontinued